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PN4393
.5V,3V,50mA,625mW Through-Hole JFET N Channel
Specifications
Case Type
TO-92
Common Source Input Capacitance (Ciss)
14 pF
Common Source Reverse Transfer Capacitance (Crss)
4 pF
Continuous Gate Current
50 mA
Drain Current-Off (ID(OFF))
200000 pA
Drain Current-Off (ID(OFF))
100 pA
Drain-Gate Voltage
40 V
Drain-Source On Resistance (rds(ON))
100 Ω
Drain-Source On Voltage (VDS(ON))
400 mV
ECCN Code
EAR99
Fall Time (tf)
30 ns
Gate Leakage Current (IGSS)
200 nA
Gate Leakage Current (IGSS)
0.1 nA
Gate-Source Breakdown Voltage (BVGSS)
40 V
Gate-Source Cutoff Voltage (VGS(OFF))
0.5 — 3 V
Gate-Source Forward Voltage (VGS(f))
1 V
Gate-Source Voltage (VGS)
40 V
HTS Code
8541.21.0095
Junction Temperature (Tj)
-65 — 150 °C
Power Dissipation
625 mW
Rise Time (tr)
5 ns
Saturation Drain Current (IDSS)
5000 — 30000 µA
Static Drain-Source On Resistance (rDS(ON))
100 Ω
Storage Temperature (Tstg)
-65 — 150 °C
Turn-off Delay Time (tOFF)
50 ns
Turn-on Delay Time (tON)
15 ns
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | .5V,3V,50mA,625mW Through-Hole JFET N Channel | Box | 2,000 | PBFREE | ||
| Active | .5V,3V,50mA,625mW Through-Hole JFET N Channel | Box | 2,000 | PBFREE | ||
| Active | .5V,3V,50mA,625mW Through-Hole JFET N Channel | Ammo | 2,000 | LEAD or TIN | No | |
| Active | .5V,3V,50mA,625mW Through-Hole JFET N Channel | Ammo | 2,000 | PBFREE | ||
| Active | .5V,3V,50mA,625mW Through-Hole JFET N Channel | Tape & Reel | 2,000 | PBFREE | ||
| Active | .5V,3V,50mA,625mW Through-Hole JFET N Channel | Tape & Reel | 2,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| PN4391-4393.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Process Change Notice:CP216 REPLACES CP206 | Process Change Notice |
| Process Change Notice:CP226 REPLACE CP216 | Process Change Notice |
| Process Change Notice:TO-92 process change eutectic | Process Change Notice |
| Product Brief:PB JFETs | Product Brief |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model PN_4393 | Spice Model |