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PN6120
40V,300mA Through-Hole Programmable UJT
Specifications
Anode-Cathode Voltage
40 V
Case Type
TO-92
DC Forward Anode Current
300 mA
DC Gate Current
50 mA
ECCN Code
EAR99
Forward Voltage (VF)
1 V
Gate-Anode Leakage Current (IGAO)
100 nA
Gate-Anode Leakage Current (IGAO)
10 nA
Gate-Anode Reverse Voltage
40 V
Gate-Cathode Forward Voltage
40 V
Gate-Cathode Leakage Current (IGKS)
100 nA
Gate-Cathode Reverse Voltage
5 V
HTS Code
8541.30.0080
Junction Temperature (Tj)
-65 — 150 °C
Offset Voltage (VT)
0.2 — 0.6 V
Offset Voltage (VT)
0.2 — 0.6 V
Peak Current (IP)
1 µA
Peak Current (IP)
0.15 µA
Peak Repetitive Forward Current
8 A
Peak Repetitive Forward Current
5 A
Power Dissipation
400 mW
Pulse Output Voltage (VO)
9 V
Pulse Voltage Rate of Rise (tr)
80 ns
Storage Temperature (Tstg)
-65 — 150 °C
Valley Current (IV)
25 µA
Valley Current (IV)
1000 µA
Valley Current (IV)
25 µA
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Special Order Item | 40V,300mA Through-Hole Programmable UJT | Box | 2,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| PN6119-18R-_PN6120-18R.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |