Product Change Notices (PCN)
This section lists the process change notices for Central Semiconductor devices.
Please note that Central Semiconductor complies with JEDEC standard JESD46: Customer Notification of Product/Process Changes by Solid-State Suppliers.
Lack of acknowledgement of a PCN within 30 days constitutes acceptance of the change.
To automatically receive Process Change Notices (PCN) you must be registered to my.centralsemi and subscribed to PCN/EOL Notifications.
PCN # | PDF Link | Excel Link | Final/Initial | Notification Date | Extent of Change |
|---|---|---|---|---|---|
PCN260 | Final | 3 September 2025 | The diameter of the CP191V and CP591X wafer processes have changed from 5" to 6". This change does not affect the physical or electrical characteristics of any device. Gross die quantities per wafer have been increased. | ||
PCN248 | Final | 13 February 2025 | Additional assembly site for all devices manufactured in the TO-72 case. | ||
PCN259 | Final | 20 November 2024 | Change in lead frame for all devices manufactured in the DPAK case. | ||
PCN258 | Final | 29 October 2024 | Additional assembly site being added for all Switching, Schottky, and Zener diodes manufactured in the SOT-23 case. | ||
PCN256 | Final | 25 July 2024 | Enhancements have been made to wafer processing to improve yields. The backside wet etch has been changed from a manual to automated process. | ||
PCN255 | Final | 23 July 2024 | Change in plating facility for all devices manufactured in the TO-72 case as well as the 2N5116. | ||
PCN251 | Final | 17 June 2024 | Additional assembly site being added for all Small Signal Transistors manufactured in the SOT-23 case. | ||
PCN229 | Final | 18 March 2024 | Complementary wafer processes CP230 and CP630 have been discontinued and are being replaced with wafer processes CP260 and CP660, respectively. | ||
PCN254 | Final | 11 March 2024 | Change in wafer fab and die size for the CBRDFSH2-40 Schottky bridge rectifier. | ||
PCN253 | Final | 11 March 2024 | Change in wafer fab and die size for the CBRDFSH1-40 Schottky bridge rectifier. | ||
PCN252 | Final | 11 March 2024 | Change in wafer fab and die size for the CBRDFSH2-100 Schottky bridge rectifier. | ||
PCN250 | Final | 11 March 2024 | Change in wafer fab and die size for the CBRDFSH1-60 Schottky bridge rectifier. | ||
PCN249 | Final | 11 March 2024 | Change in wafer fab and die size for the CBRDFSH2-60 Schottky bridge rectifier. | ||
PCN247 | Final | 19 June 2023 | Additional wafer fab site for specified transistors manufactured in the SOT-323 case. | ||
PCN243 | Final | 25 May 2023 | The CPZ28X wafer process has been discontinued and replaced with the CPZ58X and CPZ59X wafer processes. Wafer diameter increased from 5" to 6". Rev:001 added CMPZDC15V. | ||
PCN246 | Final | 14 March 2023 | Change in wafer fab and die size for the CBRDFSH1-100 Schottky bridge rectifier. | ||
PCN244 | Final | 9 December 2022 | Change in internal lead frame for custom devices manufactured in the TLM1053 case. | ||
PCN245 | Final | 3 November 2022 | Additional assembly site for general purpose rectifiers in the SMA case. | ||
PCN242 | Final | 4 October 2022 | Additional assembly site, internal die size optimization, and internal lead frame modification for the CEN1151A Schottky Bridge Rectifier. | ||
PCN236 | Final | 4 October 2022 | Change in wafer fab and die size for specific P-Channel JFETs. | ||
PCN241 | Final | 22 September 2022 | Additional lead frame supplier for all devices manufactured in the SOD-882L package. | ||
PCN240 | Final | 8 September 2022 | Additional assembly site for the CMPT5179, CMPT918 and CEN1056A RF transistors. | ||
PCN237 | Initial | 25 July 2022 | Change in assembly/test site and die size for the 2N6052 power transistor. | ||
PCN238 | Initial | 21 July 2022 | Change in die size for the TIP112 power transistor. | ||
PCN239 | Final | 30 June 2022 | Additional plating facility for all devices manufactured in the TO-72 case. | ||
PCN235 | Final | 28 April 2022 | The diameter of the CP710V wafer process has changed from 5" to 6". Gross die quantities per wafer increased. | ||
PCN233 | Final | 25 April 2022 | Change in internal lead frame for all products manufactured in the SMA case. | ||
PCN232 | Final | 7 April 2022 | Change in internal lead frame for all products manufactured in the SMB case. | ||
PCN231 | Final | 28 March 2022 | Change in internal lead frame for all products manufactured in the SMC case. | ||
PCN230 | Final | 18 March 2022 | The CPD102X wafer process has been discontinued and replaced with the CPD51V wafer process. | ||
PCN203 | Final | 12 November 2021 | Change in wire bond material for all products manufactured in the SOIC-8 case. | ||
PCN228 | Final | 22 September 2021 | Additional assembly site being added for all Schottky bridge rectifiers manufactured in the HDDIP case. | ||
PCN227 | Final | 12 August 2021 | Change in wafer fab and die size for specific NPN power transistors. | ||
PCN226 | Final | 17 June 2021 | Change in wafer fab and die size for MJ11013 and MJ11014 power transistors. | ||
PCN225 | Final | 17 June 2021 | Change in wafer fab and die size for specific NPN power transistors. | ||
PCN221 | Final | 17 June 2021 | The CP209 wafer process has been discontinued and is being replaced with the CP264V wafer process. | ||
PCN224 | Final | 14 June 2021 | Change in wafer fab and die size for specific NPN power transistors. | ||
PCN223 | Final | 14 June 2021 | Change in wafer fab and die size for specific NPN power transistors. | ||
PCN222 | Final | 14 June 2021 | Change in wafer fab and die size for 2N3442 NPN power transistor. | ||
PCN214 | Final | 7 June 2021 | Additional assembly site for diodes, rectifiers and TVSs in case 106, DO-15, DO-201, DO-201AD and DO-41 cases. | ||
PCN202 | Final | 4 June 2021 | The CP216 wafer process has been discontinued and replaced with the CP226V wafer process. | ||
PCN220 | Final | 2 June 2021 | Change in wafer fab and die size for specific NPN power transistors. | ||
PCN219 | Final | 2 June 2021 | Change in wafer fab and die size for specific NPN power transistors. | ||
PCN218 | Final | 2 June 2021 | Change in wafer fab and die size for specific NPN power transistors. | ||
PCN217 | Final | 2 June 2021 | Change in wafer fab and die size for specific PNP power transistors. | ||
PCN215 | Final | 1 June 2021 | A new plating SCP has been qualified for the CPC14-SIC10-1200-CT. | ||
PCN212 | Final | 25 May 2021 | Additional wafer fab site for Zener diodes manufactured in the DO-201 case. | ||
PCN213 | Final | 24 May 2021 | New standard 7" reel taping option; existing 13" reel taping option is now special order. | ||
PCN210 | Final | 9 April 2021 | Change in wafer fab and die size for specific PNP power transistors. | ||
PCN211 | Final | 19 March 2021 | Change in assembly site and die attach method for CZDM8502N MOSFET. | ||
PCN209 | Final | 2 March 2021 | Additional assembly site for all devices manufactured in the SOD-923 case. | ||
PCN207 | Final | 2 March 2021 | Change in die attach method for specific SOT-223 transistors. | ||
PCN205 | Final | 16 February 2021 | Additional wafer fab site for Schottky rectifiers manufactured in SMA, SMB and SMC cases. | ||
PCN199 | Final | 16 February 2021 | Change in wafer fab site and anode pad size for the CPD22 wafer process for 1A, 1000V rectifiers. | ||
PCN208 | Final | 2 February 2021 | Additional assembly site for CMKD6263 Schottky diode. | ||
PCN197 | Final | 15 January 2021 | Change in assembly site for SOT-26 diodes/transistors; change in die attach method from eutectic to silver epoxy. | ||
PCN204 | Final | 14 January 2021 | Change in wafer fab site for CMDD4448 and CMOD4448 silicon switching diodes. | ||
PCN206 | Final | 11 January 2021 | Additional wafer fab site for low voltage range TVS manufactured in the SOD-123F case. | ||
PCN201 | Final | 21 October 2020 | The diameter of the gold wire used in the CMXTVS5-4 TVS assembly process is changing from 1.0 mil to 0.8 mil. | ||
PCN195 | Final | 30 September 2020 | Additional wafer fab site for silicon controlled rectifiers (SCRs) manufactured in the TO-39 case. | ||
PCN198 | Final | 28 September 2020 | Change in wafer fab for the 2N6059 NPN power darlington transistor. | ||
PCN196 | Final | 24 September 2020 | Change in internal lead frame for all products manufactured in the SMAFL case. | ||
PCN194 | Final | 29 July 2020 | Additional wafer fab site for transient voltage suppressors (TVS) manufactured in the SMAFL case. | ||
PCN193 | Final | 29 July 2020 | Additional wafer fab site for fast, hyperfast, superfast and ultrafast recovery rectifiers. | ||
PCN192 | Final | 29 July 2020 | Additional wafer fab site for general purpose rectifiers. | ||
PCN187 | Final | 23 July 2020 | The CP372 wafer process has been discontinued and replaced with the CP403 wafer process. | ||
PCN191 | Final | 19 June 2020 | The CP771 wafer process has been discontinued and replaced with the CP805 wafer process. | ||
PCN190 | Final | 19 June 2020 | The CP375 wafer process has been discontinued and replaced with the CP406 wafer process. | ||
PCN189 | Final | 19 June 2020 | The CP371 wafer process has been discontinued and replaced with the CP405 wafer process. | ||
PCN188 | Final | 15 June 2020 | Additional wafer fab site for 5A ultrafast recovery rectifiers manufactured in the SMC case. | ||
PCN186 | Final | 12 June 2020 | The CP775 wafer process has been discontinued and replaced with the CP802 wafer process. | ||
PCN185 | Final | 1 June 2020 | Upgraded equipment for applying glass slurry and wafer process enhancements for CPR5U-040. | ||
PCN184 | Final | 29 May 2020 | Additional wafer fabrication site for TVS diodes manufactured in the SMC case. | ||
PCN183 | Final | 18 May 2020 | The CP390 wafer process has been discontinued and replaced with the CP401. | ||
PCN181 | Final | 28 April 2020 | Specific TO-92 products converted from eutectic to epoxy die attach process. | ||
PCN182 | Final | 27 April 2020 | The CP389 wafer process has been discontinued and replaced with the CP400 wafer process. | ||
PCN180 | Final | 4 February 2020 | Additional wafer fab site for transient voltage suppressors (TVS) manufactured in the SOD-123F case. | ||
PCN179 | Final | 13 January 2020 | The CP307V wafer process has been discontinued and replaced with CP327V wafer process. | ||
PCN178 | Final | 2 January 2020 | Additional wafer fab site for general purpose and ultrafast recovery rectifiers. | ||
PCN177 | Final | 30 September 2019 | The CP312 wafer process has been discontinued and replaced with the CP322 wafer process. | ||
PCN174 | Final | 27 September 2019 | The CP210 wafer process has been discontinued and replaced with the CP232V wafer process. | ||
PCN165 | Final | 27 September 2019 | The CP206 wafer process has been discontinued and replaced with the CP216 wafer process. | ||
PCN176 | Final | 27 August 2019 | The CPD66X process has been modified in order to improve throughput and process control. | ||
PCN175 | Final | 14 August 2019 | The CP147 wafer process has been discontinued and replaced with the CP247 wafer process. | ||
PCN173 | Final | 11 June 2019 | The chip size for the NPN power transistor wafer process has changed from 1.5mm x 1.5mm to 1.37mm x 1.37mm. | ||
PCN172 | Final | 21 May 2019 | The CP688 wafer has been discontinued and replaced with the CP613V wafer process. | ||
PCN171 | Final | 24 April 2019 | The CP391 wafer process has been discontinued and replaced with the CP399 wafer process. | ||
PCN170 | Final | 22 April 2019 | The CP773 wafer process is being replaced with the CP798X. | ||
PCN168 | Final | 22 April 2019 | The CP376X wafer process is being replaced with the CP387X. | ||
PCN167 | Final | 8 April 2019 | The CP373 wafer process has been discontinued and replaced with the CP398X wafer process. | ||
PCN164 | Final | 27 March 2018 | Additional wafer fab site for 350mW Zener diodes manufactured in the SOT-23 case. | ||
PCN163 | Final | 23 March 2018 | Additional wafer fab site for Zener diodes manufactured in the SMA, SMB, SMC, DO-41 and DO-201 cases. | ||
PCN158 | Final | 13 December 2017 | Change in the die attach pad size for Schottky and ultra-fast recovery rectifiers in D2PAK case. | ||
PCN162 | Final | 8 December 2017 | The CP305 wafer process has been discontinued and replaced with the CP306V wafer process. | ||
PCN161 | Final | 15 August 2017 | Change in wafer fab site for the CSMF05C series array manufactured in the SOT-363 case. | ||
PCN160 | Final | 15 August 2017 | Leadframe structure change for CBRHD-02 series bridge rectifiers. | ||
PCN159 | Final | 15 August 2017 | Change in wafer fab for CMPD914 switching diode. | ||
PCN157 | Final | 12 January 2017 | The CPS041 wafer process has been discontinued and replaced with the CPS043 wafer process. | ||
PCN156 | Final | 3 March 2016 | The CP319 wafer process has been discontinued and replaced with the CP212 wafer process. | ||
PCN154 | Final | 13 August 2015 | Thermal oxide deposition was deployed for the 3KW TVS in the SMC case. | ||
PCN153 | Final | 4 May 2015 | CP547 wafer process discontinued and replaced with CP647; wafer diameter reduced from 5" to 4". | ||
PCN152 | Final | 30 January 2015 | CP707 process replaced with CP727V; diameter increased from 4" to 5"; thickness reduced from 9.0 to 7.1 mils. | ||
PCN150 | Final | 24 June 2014 | CP517 process replaced with CP527; wafer diameter reduced from 5" to 4". | ||
PCN151 | Final | 18 June 2014 | CP188 and CP588 processes replaced with CP388X and CP788X; diameter increased from 4" to 5". | ||
PCN149 | Final | 30 May 2014 | CP117 process replaced with CP127; wafer diameter reduced from 5" to 4". | ||
PCN148 | Final | 19 February 2014 | Additional assembly site for the SOT-563 case. | ||
PCN147 | Final | 31 October 2013 | CP207 process replaced with CP396V; diameter increased from 4" to 5"; thickness reduced. | ||
PCN146 | Final | 11 September 2013 | The case type is being changed from DO-35 glass case to DO-35A glass case. | ||
PCN145 | Final | 11 March 2013 | The wafer thickness of CPD04 is being increased from 8.5 mils to 10.5 mils. | ||
PCN144 | Final | 9 January 2013 | Copper wire bonding added as a qualified material for SOD-523 case. | ||
PCN143 | Final | 12 November 2012 | Alternate marking codes added to the CSHDD16-40C line. | ||
PCN142 | Final | 22 October 2012 | Copper wire bonding added as a qualified material for SOT-523 case. | ||
PCN141 | Final | 18 October 2012 | Copper wire bonding added as a qualified material for SOT-563 case. | ||
PCN140 | Final | 13 August 2012 | Anode pad size increased from 66x66 to 77x77 mils for CPD06 wafer process. | ||
PCN139 | Final | 17 May 2012 | Minor electrical specification changes to CMPT3640 switching transistor. | ||
PCN138 | Final | 17 May 2012 | Minor electrical specification changes to specific PNP TO-92 switching transistors. | ||
PCN137 | Final | 30 April 2012 | The CP716V chip process replaced by the CP736V wafer process. | ||
PCN136 | Final | 9 April 2012 | ESD packaging changed from blue poly bag to silver static shielded bag. | ||
PCN135 | Final | 30 March 2012 | Leadframe change for TLM322 case to allow sawing instead of punching. | ||
PCN134 | Final | 30 March 2012 | Leadframe change for TLM832D case to allow sawing instead of punching. | ||
PCN133 | Final | 6 March 2012 | Copper wire bonding added as a qualified material for SOT-223 case. | ||
PCN132 | Final | 1 February 2012 | Copper wire bonding added as a qualified material for SOT-89 case. | ||
PCN131 | Final | 8 December 2011 | Consolidation of PNP switches; CM4209 in TO-18 developed as primary replacement. | ||
PCN130 | Final | 2 November 2011 | CBRSDSH5-40/60 replaced with CBRSDSH2-40/60 in SMDIP case. | ||
PCN129 | Final | 5 October 2011 | Chip process CP195, NPN small signal transistors change. | ||
PCN128 | Final | 22 September 2011 | Matte tin plating removed from BAV45 (TO-18 two-leaded) manufacturing process. | ||
PCN127 | Final | 8 June 2011 | CPZ18 chip process replaced by CPZ28X; reduction in die area and thickness. | ||
PCN125 | Final | 5 April 2011 | CPD69 process: wafer thickness increased from 8.5 to 12.5 mils. | ||
PCN123 | Final | 1 February 2011 | BAW101 in SOT-143 case: Alternate marking code added. | ||
PCN120 | Final | 21 December 2010 | CEN1180 devices manufactured with code P2B or P2A. | ||
PCN119 | Final | 16 December 2010 | Small signal wafer diameter increased from 4" to 5". | ||
PCN118 | Final | 19 October 2010 | CP316V chip process replaced by CP336V; die size reduction. | ||
PCN121 | Final | 1 October 2010 | Zener and switching diodes in DO-35: Alternate marking format added. | ||
PCN117 | Final | 5 August 2010 | Surface mount CLDs in SOD-80 case being replaced by SOD-123FL equivalents. | ||
PCN113 | Final | 25 June 2010 | Copper wire bonding added for SOD-123, SOT-23, and SOT-323 packages. | ||
PCN116 | Final | 11 June 2010 | Tin (Sn) wafer backside metal added for SOD-123, SOT-23, and SOT-323. | ||
PCN112 | Final | 31 March 2010 | Leadframe change for TLM833 case to allow sawing instead of punching. | ||
PCN110 | Final | 21 April 2009 | CPD64 process: wafer diameter increased to 5"; thickness reduced. | ||
PCN109 | Final | 21 April 2009 | CPD41 process replaced by CPD93V; die area reduction. | ||
PCN124 | Final | 10 January 2009 | Alloy42 lead frame added as qualified material for SOT-563 package. | ||
PCN108 | Final | 3 January 2008 | CPZ19 process replaced by CPZ28; die area reduction. | ||
PCN107 | Final | 29 June 2006 | Die area reduction for CP192V/CP592V processes; replaced by CP392V/CP792V. | ||
PCN106 | Final | 22 September 2005 | 5.0W Zener diodes in AX-5W case replaced by DO-201 case. | ||
PCN126 | Final | 13 June 2005 | CP214 RF process replaced by CP229; die size and pattern change. | ||
PCN105 | Final | 24 November 2004 | Small signal wafer thickness reduced from 9.0 mils to 7.1 mils. | ||
PCN104 | Final | 24 November 2004 | SOD-80 cylindrical case replaced by flat SOD-123 case. | ||
PCN103 | Final | 20 January 2003 | TO-92 -18R lead formed package change. | ||
PCN102 | Final | 12 November 2001 | Dimension change to all Bridge Rectifiers in DIP package. | ||
PCN101 | Final | 12 November 2001 | Dimension change to all Bridge Rectifiers in SMDIP package. |