Reliability Tests
Central Semiconductor performs extensive reliability stress testing on a variety of products from our product portfolio. This data is collected in addition to Central's standard qualification test data for any new or changed product.
Typical Results:
No. | Test Item | Test Condition | Failure Rate |
|---|---|---|---|
1 | HTSL (Bake) | TA = 150°C, t = 1000 hours | 0/77 |
2 | HTRB | TA = 125°C, t = 1000 hours; Bias conditions per device datasheet | 0/77 |
3 | THB | TA = 85°C, RH = 85%, t = 1000 hours; Bias conditions per device datasheet | 0/77 |
4 | HAST | TA = 130°C, RH = 85%, t = 96 hours or TA = 110°C, RH = 85%, t = 264 hours | 0/77 |
5 | Temperature Cycling | (150°C for 15 min. / -65°C for 15 min.) x 1000 cycles | 0/77 |
6 | Thermal Shock | Liquid to Liquid (-65°C to 150°C) x 1000 cycles | 0/77 |
7 | Autoclave | TA = 121°C, p = 15 PSIG, t = 96 hours | 0/77 |
8 | Solderability | Steam age = 8 hours, T(Solder) = 245°C, t = 5 sec. | 0/77 |
9 | Solder Shock | T(Solder) = 260°C, t = 10 sec. | 0/77 |