When Failure is not an option
Prevent the high cost of repairs. Engineers are increasingly experiencing failures due to high temperatures, moisture levels, corrosion, and high vibration conditions. As a leading manufacturer of high-reliability components, Central Semiconductor has developed ruggedized devices to meet the challenges of extreme environments.
We solve these challenges by enhancing our design parameters — utilizing high-temperature die attach, gold wire bonds, and corrosion-free materials — all while maintaining industry-standard pad layouts. The result is a robust, high-reliability component that delivers superior performance in mission-critical applications.
Superior construction
The ruggedized family of semiconductors are built with the following design elements:
- Alloy 42 copper plated lead frame
- Eutectic die attach
- 0.8 mil gold wire bond
- Silver free package
- Pb/Sn lead plating available