Tailored Wafer Diffusion
For unique electrical requirements, our special wafer diffusion options are specially engineered to yield the exact specifications your device demands.
We go beyond conventional methods to ensure your wafers achieve precise electrical characteristics necessary for even the most challenging applications.
Custom Metallization options
Our advanced metallization capabilities include:
- Custom backside metallization: We can apply specific backside metallization layers to significantly improve solderability, ensuring robust and reliable connections for your components.
- Selective metal removal: When certain metals interfere with device functionality or subsequence processing, we can perform precision removal of specific metals from your wafer process for optimized performance and compatibility.