Commercial off-the-shelf solutions
Pure tin surface-mount components pose a significant risk to mission-critical systems due to the formation of tin whiskers. AEM’s TWM COTS semiconductors bridge the gap between commercial availability and high-reliability standards.
As a leading manufacturer of high-reliability devices for use in military, aerospace, and medical electronic products, Central Semiconductor has created a Commercial Off-the-Shelf Tin Whisker Mitigated (TWM) line of discrete semiconductors designed to virtually eliminate the formation of tin whiskers on Pure Tin surface-mount component terminations.
Transient Voltage Suppressors:
Low Leakage Switching Diode:
The AEM proprietary plating process delivers superior quality while eliminating the potential damage to sensitive electronic devices caused by conventional hot solder dipping. AEM’s Sn/Pb conversion process is ideal for all active surface mount semiconductor packages.
AEM’s Tin Whisker Mitigation applies a proprietary, aerospace, defense, and space-qualified Sn/Pb conversion process that ensures uniform coverage and material consistency across all termination surfaces, including wraparound, recessed, and fine-pitch geometries.
The process incorporates controlled plating and fusion steps to produce a fully converted alloy finish, optimized for solderability, planarity, and mechanical reliability. Rigorous in-process inspection and sample-level destructive analysis confirm conversion integrity, adhesion, and compatibility with high-reliability soldering standards.
Final visual inspection is performed on 100% of the lot, and optional electrical testing or up screening can be added per customer or program requirements. All work is performed within AEM’s AS9100D / ISO 9001-certified quality system, ensuring repeatability, traceability, and compliance with stringent aerospace and defense standards.
