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AEM

Central Semiconductor

Open Current Carrying Capacity for Semiconductor Wire Bonds

Current Carrying Capacity for Semiconductor Wire Bonds

The current carrying capacity of a semiconductor is a crucial characteristic directly influenced by the device's material resistivity, thermal properties, and active area. Fundamentally, this capacity represents the maximum power the device can dissipate, as the voltage drop across a functional semiconductor remains constant once it reaches saturation.

Open Implementing Basic Amplification Stages with Small Signal BJTs

Implementing Basic Amplification Stages with Small Signal BJTs

The basis for small signal bipolar junction transistors (BJTs) is simple: They are the best way to amplify an input signal without introducing large amounts of distortion to the output signal, creating near ideal amplification.

Renaissance

AEM Components

Open Automotive-Grade Surface-Mount Fuses Achieve New AEC-Q200 Compliance

Automotive-Grade Surface-Mount Fuses Achieve New AEC-Q200 Compliance

All AEM automotive-grade surface mount fuses meet new industry regulations of AEC-Q200 Rev E. The new AEC-Q200 Rev E qualification outlines clear requirements for fuse performance before and after stress tests, which set a higher standard for safety and reliability.