BAS56
200mA,60V Surface mount Diode-Switching Dual
Specifications
Average Forward Current
200 mA
Case Type
SOT-143
Continuous Reverse Voltage
60 V
ECCN Code
EAR99
Forward Recovery Voltage (Vfr)
1.5 V
Forward Recovery Voltage (Vfr)
1.2 V
Forward Voltage (VF)
1 V
Forward Voltage (VF)
1.25 V
Forward Voltage (VF)
0.75 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
2.5 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
1 A
Peak Forward Surge Current
4 A
Peak Repetitive Forward Current
400 mA
Peak Repetitive Reverse Voltage
60 V
Power Dissipation
350 mW
Reverse Recovery Time (trr)
6 ns
Reverse Voltage Leakage Current (IR)
100 µA
Reverse Voltage Leakage Current (IR)
10 µA
Reverse Voltage Leakage Current (IR)
0.1 µA
Storage Temperature (Tstg)
-65 — 150 °C
Stored Charge (Qs)
0.05 nC
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Discontinued | 200mA,60V Surface mount Diode-Switching Dual | Box | 1,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Alloy 42 leadframe | Analytical Test Report |
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| BAS56R2.PDF | Device Datasheet |
| Material Composition:SOT-143 | Material Composition |
| Package Detail Document:SOT-143 | Package Detail Document |
| Process Change Notice:CPD41 REPLACED WITH CPD93V | Process Change Notice |
| Product EOL Notice:CMPD4150 | Product EOL Notice |
| Spice Model:Spice Model BAS56 | Spice Model |
| Step File 3D Object:SOT-143 (TO-253AA) | Step File 3D Object |