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C103Y
.8A,30V Through-Hole SCR
Specifications
Average Gate Power
10 mW
Case Type
TO-92
ECCN Code
EAR99
Forward Voltage (VTM)
1.5 V
Gate Trigger Current (IGT)
0.5 mA
Gate Trigger Current (IGT)
0.2 mA
Gate Trigger Voltage (VGT)
1 V
Gate Trigger Voltage (VGT)
0.1 V
Gate Trigger Voltage (VGT)
0.8 V
Holding Current (IH)
10 mA
Holding Current (IH)
5 mA
HTS Code
8541.30.0080
Junction Temperature (Tj)
-65 — 125 °C
Peak Forward Gate Current
500 mA
Peak Gate Power
1 W
Peak Off-State Blocking Current (IDRM)
50 µA
Peak Off-State Blocking Current (IDRM)
1 µA
Peak One Cycle Surge Current
8 A
Peak Repetitive Off-State Voltage
30 V
Peak Repetitive Reverse Voltage
30 V
Peak Reverse Blocking Current (IRRM)
50 µA
Peak Reverse Blocking Current (IRRM)
1 µA
Peak Reverse Gate Voltage
8 V
Rate of Rise of Reverse Voltage (dv/dt)
20 V/µs
RMS On-State Current
800 mA
Storage Temperature (Tstg)
-65 — 150 °C
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | .8A,30V Through-Hole SCR | Box | 2,500 | LEAD or TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bonding Wire | Analytical Test Report |
| Analytical Test Report:Copper Wire | Analytical Test Report |
| Analytical Test Report:Epoxy Adhesive | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Free | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder, Sn | Analytical Test Report |
| Analytical Test Report:Tin Plating | Analytical Test Report |
| C103_SERIES.PDF | Device Datasheet |
| Material Composition:TO-92 | Material Composition |
| Package Detail Document:TO-92 | Package Detail Document |
| Process Change Notice:SCR'S FROM TO-92-18R TO TO-92 | Process Change Notice |
| Product Reliability Data:TO-92 Package Reliability | Product Reliability Data |