CBAS17
250mA,350mW Surface mount Stabistor
Specifications
Case Type
SOT-23
ECCN Code
EAR99
Forward Voltage (VF)
665 — 760 V(745 V Typical)
Forward Voltage (VF)
0.725 — 0.82 V(0.805 V Typical)
Forward Voltage (VF)
0.75 — 0.84 V(0.825 V Typical)
Forward Voltage (VF)
0.87 — 0.96 V(0.92 V Typical)
Forward Voltage (VF)
0.58 — 0.68 V(0.665 V Typical)
HTS Code
8541.10.0050
Junction Capacitance (CJ)
140 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Repetitive Forward Current
250 mA
Power Dissipation
350 mW
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Discontinued, Stock Only | 250mA,350mW Surface mount Stabistor | Box | 3,500 | PBFREE | |
| Discontinued, Stock Only | 250mA,350mW Surface mount Stabistor | Tape & Reel | 3,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CBAS17.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CPD66X DOPANT CHANGE | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-23 | Step File 3D Object |