CBAT54C
Surface mount Diode-Schottky (<1A) Dual: Common Cathode
Specifications
Case Type
SOT-23
Continuous Forward Current
200 mA
Continuous Reverse Voltage
30 V
Diode Capacitance (Cd)
10 pF
ECCN Code
EAR99
Forward Voltage (VF)
0.4 V
Forward Voltage (VF)
0.5 V
Forward Voltage (VF)
0.24 V
Forward Voltage (VF)
0.8 V
Forward Voltage (VF)
0.32 V
HTS Code
8541.10.0070
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
600 mA
Peak Repetitive Forward Current
300 mA
Power Dissipation
350 mW
Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
2 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | Surface mount Diode-Schottky (<1A) Dual: Common Cathode | Box | 3,500 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CBAT54.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Switching, Schottky and | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CBAT54C | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |