CBRHD-02
500mA,200V Surface mount Rectifier-Bridge General Purpose
Specifications
Average Forward Current
800 mA
Average Forward Current
500 mA
Case Type
HDDIP
Continuous Reverse Voltage
200 V
ECCN Code
EAR99
Forward Voltage (VF)
1 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
20 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
30 A
Peak Repetitive Reverse Voltage
200 V
Reverse Voltage Leakage Current (IR)
500 µA
Reverse Voltage Leakage Current (IR)
5 µA
RMS Reverse Voltage
140 V
Storage Temperature (Tstg)
-65 — 150 °C
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 500mA,200V Surface mount Rectifier-Bridge General Purpose | Box | 350 | TIN | No | |
| Active | 500mA,200V Surface mount Rectifier-Bridge General Purpose | Tape & Reel | 3,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Molding Compound | Analytical Test Report |
| Analytical Test Report:Hi-Lead Solder Paste | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Plating | Analytical Test Report |
| CBRHD.PDF | Device Datasheet |
| Material Composition:HD DIP | Material Composition |
| Package Detail Document:HDDIP | Package Detail Document |
| Process Change Notice:CBRHD-10 | Process Change Notice |
| Process Change Notice:CPD04 Wafer Thickness Increase | Process Change Notice |
| Process Change Notice:HD DIP Marking code change | Process Change Notice |
| Product Reliability Data:HDDIP Package Reliability | Product Reliability Data |