CBRHDSH1-100
1A,100V Surface mount Rectifier-Bridge Schottky
Specifications
Average Forward Current
1 A
Case Type
HDDIP
Continuous Reverse Voltage
100 V
ECCN Code
EAR99
Forward Voltage (VF)
0.7 V
Forward Voltage (VF)
0.75 V
HTS Code
8541.10.0080
Junction Capacitance (CJ)
230 pF
Junction Temperature (Tj)
-50 — 125 °C
Peak Forward Surge Current
20 A
Peak Repetitive Reverse Voltage
100 V
Power Dissipation
1.2 W
Reverse Breakdown Voltage (BVR)
100 V
Reverse Voltage Leakage Current (IR)
20000 µA
Reverse Voltage Leakage Current (IR)
1000 µA
Reverse Voltage Leakage Current (IR)
10 µA
RMS Reverse Voltage
71 V
Storage Temperature (Tstg)
-55 — 150 °C
Thermal Resistance Junction-Ambient
85 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 1A,100V Surface mount Rectifier-Bridge Schottky | Box | 350 | PBFREE | ||
| Active | 1A,100V Surface mount Rectifier-Bridge Schottky | Tape & Reel | 3,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Die Attach | Analytical Test Report |
| Analytical Test Report:Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Green Molding Compound | Analytical Test Report |
| Analytical Test Report:Hi-Lead Solder Paste | Analytical Test Report |
| Analytical Test Report:Lead Frame | Analytical Test Report |
| Analytical Test Report:Pure Tin Plating | Analytical Test Report |
| CBRHDSH1-90_100.PDF | Device Datasheet |
| Material Composition:HD DIP | Material Composition |
| Package Detail Document:HDDIP | Package Detail Document |
| Process Change Notice:HD DIP Marking code change | Process Change Notice |
| Process Change Notice:Schottky bridges in HDDIP case | Process Change Notice |
| Product Reliability Data:HDDIP Package Reliability | Product Reliability Data |