CMAD6001
100V Surface mount Diode-Ultra Low Leakage Single
Specifications
Case Type
SOD-923
Continuous Forward Current
250 mA
Continuous Reverse Voltage
75 V
ECCN Code
EAR99
Forward Voltage (VF)
0.95 V
Forward Voltage (VF)
1.1 V
Forward Voltage (VF)
0.85 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
2 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
3 A
Peak Repetitive Reverse Voltage
100 V
Power Dissipation
100 mW
Reverse Breakdown Voltage (BVR)
100 V
Reverse Recovery Time (trr)
3000 ns
Reverse Voltage Leakage Current (IR)
0.0005 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
1250 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 100V Surface mount Diode-Ultra Low Leakage Single | Box | 5,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMAD6001.PDF | Device Datasheet |
| Material Composition:SOD-923 | Material Composition |
| Package Detail Document:SOD-923 | Package Detail Document |
| Process Change Notice:SOD-923 CASE | Process Change Notice |
| Product Reliability Data:SOD-923 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMAD6001 | Spice Model |