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CMHSH-3
30V Surface mount Diode-Schottky (<1A) Single
Specifications
Case Type
SOD-123
Continuous Forward Current
200 mA
ECCN Code
EAR99
Forward Voltage (VF)
0.4 V
Forward Voltage (VF)
0.5 V
Forward Voltage (VF)
0.24 V
Forward Voltage (VF)
1 V
Forward Voltage (VF)
0.32 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
7 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
600 mA
Peak Repetitive Forward Current
300 mA
Peak Repetitive Reverse Voltage
30 V
Power Dissipation
400 mW
Reverse Breakdown Voltage (BVR)
30 V
Reverse Recovery Time (trr)
7 ns
Reverse Voltage Leakage Current (IR)
2 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
312.5 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 30V Surface mount Diode-Schottky (<1A) Single | Box | 3,500 | TIN | No | |
| Active | 30V Surface mount Diode-Schottky (<1A) Single | Tape & Reel | 3,000 | LEAD or TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMHSH-3.PDF | Device Datasheet |
| Material Composition:SOD-123 | Material Composition |
| Package Detail Document:SOD-123 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOD-123 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMHSH-3 | Spice Model |