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CMHZ5228B
3.9V,500mW Surface mount Diode-Zener Single: Standard
Specifications
Case Type
SOD-123
ECCN Code
EAR99
Forward Voltage (VF)
0.9 V
HTS Code
8541.10.0050
Junction Temperature (Tj)
-65 — 150 °C
Maximum Temperature Coefficient (ΘVZ)
-0.06 %/°C
Power Dissipation
500 mW
Reverse Voltage Leakage Current (IR)
10 µA
Storage Temperature (Tstg)
-65 — 175 °C
Thermal Resistance Junction-Lead
150 °C/W
Zener Impedance (ZZT)
23 Ω
Zener Knee Impedance (ZZK)
1900 Ω
Zener Voltage (VZ)
3.705 — 4.095 V(3.9 V Typical)
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 3.9V,500mW Surface mount Diode-Zener Single: Standard | Box | 3,500 | PBFREE | ||
| Special Order Item | 3.9V,500mW Surface mount Diode-Zener Single: Standard | Tape & Reel | 3,000 | TIN | No | |
| Special Order Item | 3.9V,500mW Surface mount Diode-Zener Single: Standard | Tape & Reel | 10,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMHZ5225B-5267B.PDF | Device Datasheet |
| Material Composition:SOD-123 | Material Composition |
| Package Detail Document:SOD-123 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CPZ18 REPLACED WITH CPZ28X | Process Change Notice |
| Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X | Process Change Notice |
| Product Reliability Data:SOD-123 Package Reliability | Product Reliability Data |