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CMLD3003DOG-RZ
200mA SMD Ruggedized Devices Diode-Low Leakage Dual: Opposing Polarity
Specifications
Average Forward Current
200 mA
Case Type
SOT-563
Continuous Forward Current
600 mA
Continuous Reverse Voltage
180 V
ECCN Code
EAR99
Forward Voltage (VF)
0.72 — 0.83 V
Forward Voltage (VF)
0.8 — 0.89 V
Forward Voltage (VF)
0.83 — 0.93 V
Forward Voltage (VF)
0.87 — 1.1 V
Forward Voltage (VF)
0.9 — 1.15 V
Forward Voltage (VF)
0.62 — 0.72 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
4 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
1 A
Peak Forward Surge Current
2 A
Peak Repetitive Forward Current
700 mA
Power Dissipation
250 mW
Reverse Breakdown Voltage (BVR)
200 V
Reverse Voltage Leakage Current (IR)
3 µA
Reverse Voltage Leakage Current (IR)
0.01 µA
Reverse Voltage Leakage Current (IR)
5 µA
Reverse Voltage Leakage Current (IR)
0.001 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
500 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 200mA SMD Ruggedized Devices Diode-Low Leakage Dual: Opposing Polarity | Tape & Reel | 3,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLD3003DO.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Product Brief:PB_RUGGEDIZED | Product Brief |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |