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CMLD4448
250mA,120V Surface mount Diode-Switching Dual
Specifications
Average Forward Current
250 mA
Case Type
SOT-563
ECCN Code
EAR99
Forward Voltage (VF)
0.67 — 0.77 V(0.72 V Typical)
Forward Voltage (VF)
0.85 — 1 V(0.91 V Typical)
Forward Voltage (VF)
0.55 — 0.65 V(0.59 V Typical)
HTS Code
8541.10.0070
Junction Capacitance (CJ)
1.5 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
1 A
Peak Forward Surge Current
4 A
Peak Repetitive Forward Current
500 mA
Peak Repetitive Reverse Voltage
120 V
Power Dissipation
250 mW
Reverse Breakdown Voltage (BVR)
120 V
Reverse Recovery Time (trr)
4 ns
Reverse Voltage Leakage Current (IR)
100 µA
Reverse Voltage Leakage Current (IR)
0.5 µA
Reverse Voltage Leakage Current (IR)
0.3 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
500 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Discontinued | 250mA,120V Surface mount Diode-Switching Dual | Box | 5,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLD4448.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-563 | Process Change Notice |
| Process Change Notice:SOT-563 Alternate Lead Frame | Process Change Notice |
| Process Change Notice:SOT-563 Mechanical Outline | Process Change Notice |
| Product EOL Notice:SOT-563 OPTION2 | Product EOL Notice |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMLD4448 | Spice Model |