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CMLSH05-4-RZ
40V SMD Ruggedized Devices Diode-Schottky (<1A) Single: High Current: Low VF
Specifications
Case Type
SOT-563
Continuous Forward Current
500 mA
ECCN Code
EAR99
Forward Voltage (VF)
0.27 V
Forward Voltage (VF)
0.13 V
Forward Voltage (VF)
0.35 V
Forward Voltage (VF)
0.47 V
Forward Voltage (VF)
0.21 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
50 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
10 A
Peak Repetitive Forward Current
3.5 A
Peak Repetitive Reverse Voltage
40 V
Power Dissipation
250 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Voltage Leakage Current (IR)
100 µA
Reverse Voltage Leakage Current (IR)
30 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
500 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 40V SMD Ruggedized Devices Diode-Schottky (<1A) Single: High Current: Low VF | Tape & Reel | 3,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLSH05-4.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Product Brief:PB_RUGGEDIZED | Product Brief |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |