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CMLSH2-4LS
40V Surface mount Diode-Schottky (<1A) Dual Pair: Low VF: In Series
Specifications
Case Type
SOT-563
Continuous Forward Current
200 mA
ECCN Code
EAR99
Forward Voltage (VF)
0.6 V
Forward Voltage (VF)
0.26 V
Forward Voltage (VF)
0.75 V
Forward Voltage (VF)
0.31 V
Forward Voltage (VF)
0.33 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
10 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
600 mA
Peak Repetitive Forward Current
300 mA
Peak Repetitive Reverse Voltage
40 V
Power Dissipation
300 mW
Power Dissipation
150 mW
Power Dissipation
350 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
0.5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 40V Surface mount Diode-Schottky (<1A) Dual Pair: Low VF: In Series | Box | 5,000 | PBFREE | |
| Special Order Item | 40V Surface mount Diode-Schottky (<1A) Dual Pair: Low VF: In Series | Tape & Reel | 3,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLSH2-4LC.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-563 | Process Change Notice |
| Process Change Notice:SOT-563 Alternate Lead Frame | Process Change Notice |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMLSH2-4LS | Spice Model |