No image available
CMLZDA6V2
6.2V,250mW Surface mount Diode-Zener Dual: Common Anode
Specifications
Case Type
SOT-563
ECCN Code
EAR99
Forward Voltage (VF)
0.9 V
HTS Code
8541.10.0050
Junction Temperature (Tj)
-65 — 150 °C
Maximum Temperature Coefficient (ΘVZ)
0.04 %/°C
Maximum Zener Current
28 mA
Power Dissipation
250 mW
Reverse Voltage Leakage Current (IR)
3 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
500 °C/W
Zener Impedance (ZZT)
10 Ω
Zener Knee Impedance (ZZK)
150 Ω
Zener Voltage (VZ)
5.8 — 6.6 V(6.2 V Typical)
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Discontinued | 6.2V,250mW Surface mount Diode-Zener Dual: Common Anode | Box | 5,000 | PBFREE | |
| Discontinued | 6.2V,250mW Surface mount Diode-Zener Dual: Common Anode | Tape & Reel | 3,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMLZDA2V4_SERIES.PDF | Device Datasheet |
| Material Composition:SOT-563 | Material Composition |
| Package Detail Document:SOT-563 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-563 | Process Change Notice |
| Process Change Notice:CPZ18 REPLACED WITH CPZ28X | Process Change Notice |
| Process Change Notice:SOT-563 Alternate Lead Frame | Process Change Notice |
| Product EOL Notice:SOT-563 OPTION2 | Product EOL Notice |
| Product Reliability Data:SOT-563 Package Reliability | Product Reliability Data |