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AEM

CMOD2005

200mA,350V Surface mount Diode-Switching Single: High Voltage

Specifications

Average Forward Current
200 mA
Case Type
SOD-523
Continuous Forward Current
250 mA
Continuous Reverse Voltage
300 V
ECCN Code
EAR99
Forward Voltage (VF)
1 V
Forward Voltage (VF)
1.25 V
Forward Voltage (VF)
0.87 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
5 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
4.5 A
Peak Repetitive Forward Current
1 A
Peak Repetitive Reverse Voltage
350 V
Power Dissipation
500 mW
Power Dissipation
250 mW
Reverse Breakdown Voltage (BVR)
350 V
Reverse Recovery Time (trr)
50 ns
Reverse Voltage Leakage Current (IR)
100 µA
Reverse Voltage Leakage Current (IR)
0.1 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
500 °C/W
Thermal Resistance Junction-Lead
120 °C/W

Product Options

PartStatusDescriptionPackaging CodePackaging QtyTerminationvariant_ncnr
Active200mA,350V Surface mount Diode-Switching Single: High VoltageBox5,000PBFREE
Special Order Item200mA,350V Surface mount Diode-Switching Single: High VoltageTape & Reel3,000TINNo

Resources

ItemType
Analytical Test Report:Alloy 42 leadframeAnalytical Test Report
Analytical Test Report:Copper Bond WireAnalytical Test Report
Analytical Test Report:DieAnalytical Test Report
Analytical Test Report:Gold Bond WireAnalytical Test Report
Analytical Test Report:Green Epoxy Molding CompoundAnalytical Test Report
Analytical Test Report:Halogen Epoxy Molding CompoundAnalytical Test Report
Analytical Test Report:LeadframeAnalytical Test Report
Analytical Test Report:Sn PlatingAnalytical Test Report
Analytical Test Report:Sn PlatingAnalytical Test Report
CMOD2005.PDFDevice Datasheet
Material Composition:SOD-523Material Composition
Package Detail Document:SOD-523Package Detail Document
Process Change Notice:Copper Wire Bonding - SOD-523Process Change Notice
Product Reliability Data:SOD-523 Package ReliabilityProduct Reliability Data

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