CMOD4448-RZ
100V SMD Ruggedized Devices Diode-Switching Single
Specifications
Case Type
SOD-523
Continuous Forward Current
250 mA
Continuous Reverse Voltage
75 V
ECCN Code
EAR99
Forward Voltage (VF)
1 V
Forward Voltage (VF)
0.62 — 0.72 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
4 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
1 A
Peak Forward Surge Current
4 A
Peak Repetitive Forward Current
500 mA
Peak Repetitive Reverse Voltage
100 V
Power Dissipation
250 mW
Reverse Breakdown Voltage (BVR)
100 V
Reverse Breakdown Voltage (BVR)
75 V
Reverse Recovery Time (trr)
4 ns
Reverse Voltage Leakage Current (IR)
0.025 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
500 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 100V SMD Ruggedized Devices Diode-Switching Single | Tape & Reel | 3,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Alloy 42 leadframe | Analytical Test Report |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMOD4448.PDF | Device Datasheet |
| Material Composition:SOD-523 | Material Composition |
| Package Detail Document:SOD-523 | Package Detail Document |
| Product Brief:PB_RUGGEDIZED | Product Brief |
| Product Reliability Data:SOD-523 Package Reliability | Product Reliability Data |