CMOSH2-4L
200mA,40V Surface mount Diode-Schottky (<1A) Single: Low VF
Specifications
Average Forward Current
200 mA
Case Type
SOD-523
ECCN Code
EAR99
Forward Voltage (VF)
0.4 V
Forward Voltage (VF)
0.5 V
Forward Voltage (VF)
0.325 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
10 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
1 A
Peak Repetitive Forward Current
350 mA
Peak Repetitive Reverse Voltage
40 V
Power Dissipation
250 mW
Reverse Breakdown Voltage (BVR)
40 V
Reverse Recovery Time (trr)
5 ns
Reverse Voltage Leakage Current (IR)
50 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
500 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 200mA,40V Surface mount Diode-Schottky (<1A) Single: Low VF | Box | 5,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Alloy 42 leadframe | Analytical Test Report |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMOSH2-4L.PDF | Device Datasheet |
| Material Composition:SOD-523 | Material Composition |
| Package Detail Document:SOD-523 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOD-523 | Process Change Notice |
| Product Reliability Data:SOD-523 Package Reliability | Product Reliability Data |
| Spice Model:I-Spice Model CMOSH2-4L | Spice Model |