CMOZ3L9
3.9V,250mW Surface mount Diode-Zener Single: Low Level
Specifications
Case Type
SOD-523
ECCN Code
EAR99
Forward Voltage (VF)
0.9 V
HTS Code
8541.10.0050
Junction Temperature (Tj)
-65 — 150 °C
Power Dissipation
250 mW
Reverse Voltage Leakage Current (IR)
5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
500 °C/W
Zener Impedance (ZZT)
1600 Ω
Zener Voltage (VZ)
3.71 — 4.1 V(3.9 V Typical)
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 3.9V,250mW Surface mount Diode-Zener Single: Low Level | Box | 5,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Alloy 42 leadframe | Analytical Test Report |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMOZ2L4_SERIES.PDF | Device Datasheet |
| Material Composition:SOD-523 | Material Composition |
| Package Detail Document:SOD-523 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOD-523 | Process Change Notice |
| Process Change Notice:CPZ18 REPLACED WITH CPZ28X | Process Change Notice |
| Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X | Process Change Notice |
| Product Reliability Data:SOD-523 Package Reliability | Product Reliability Data |