CMOZ3V3
3.3V,350mW Surface mount Diode-Zener Single: Standard
Specifications
Case Type
SOD-523
ECCN Code
EAR99
Forward Voltage (VF)
0.9 V
HTS Code
8541.10.0050
Junction Temperature (Tj)
-65 — 150 °C
Power Dissipation
300 mW
Power Dissipation
250 mW
Power Dissipation
350 mW
Reverse Voltage Leakage Current (IR)
2 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
417 °C/W
Zener Impedance (ZZT)
95 Ω
Zener Voltage (VZ)
3.14 — 3.47 V(3.3 V Typical)
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 3.3V,350mW Surface mount Diode-Zener Single: Standard | Box | 5,000 | TIN | No | |
| Active | 3.3V,350mW Surface mount Diode-Zener Single: Standard | Tape & Reel | 3,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Alloy 42 leadframe | Analytical Test Report |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMOZ2V4_SERIES.PDF | Device Datasheet |
| Material Composition:SOD-523 | Material Composition |
| Package Detail Document:SOD-523 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOD-523 | Process Change Notice |
| Process Change Notice:CPZ18 REPLACED WITH CPZ28X | Process Change Notice |
| Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X | Process Change Notice |
| Product Reliability Data:SOD-523 Package Reliability | Product Reliability Data |