CMOZ9V1C
9.1V,350mW Surface mount Diode-Zener Single: Standard Tight Tolerance
Specifications
Case Type
SOD-523
ECCN Code
EAR99
Forward Voltage (VF)
0.9 V
HTS Code
8541.10.0050
Junction Temperature (Tj)
-65 — 150 °C
Power Dissipation
300 mW
Power Dissipation
250 mW
Power Dissipation
350 mW
Reverse Voltage Leakage Current (IR)
0.5 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
417 °C/W
Zener Impedance (ZZT)
15 Ω
Zener Voltage (VZ)
8.92 — 9.28 V(9.1 V Typical)
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Discontinued, Stock Only | 9.1V,350mW Surface mount Diode-Zener Single: Standard Tight Tolerance | Box | 5,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Alloy 42 leadframe | Analytical Test Report |
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Die | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMOZ2V4C_SERIES.PDF | Device Datasheet |
| Material Composition:SOD-523 | Material Composition |
| Package Detail Document:SOD-523 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOD-523 | Process Change Notice |
| Process Change Notice:CPZ19 REPLACED WITH CPZ28 | Process Change Notice |
| Product Reliability Data:SOD-523 Package Reliability | Product Reliability Data |