CMPD2003
200mA,250V Surface mount Diode-Switching Single: High Voltage
Specifications
Average Forward Current
200 mA
Case Type
SOT-23
Continuous Forward Current
250 mA
Continuous Reverse Voltage
200 V
ECCN Code
EAR99
Forward Voltage (VF)
1.25 V
Forward Voltage (VF)
1 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
5 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
1 A
Peak Forward Surge Current
4 A
Peak Repetitive Forward Current
625 mA
Peak Repetitive Reverse Voltage
250 V
Power Dissipation
350 mW
Reverse Breakdown Voltage (BVR)
250 V
Reverse Recovery Time (trr)
50 ns
Reverse Voltage Leakage Current (IR)
100 µA
Reverse Voltage Leakage Current (IR)
0.1 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 200mA,250V Surface mount Diode-Switching Single: High Voltage | Box | 3,500 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMPD2003S_3C_4C.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Switching, Schottky and | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMPD2003 | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |