CMPD6001C
100V Surface mount Diode-Ultra Low Leakage Dual: Common Cathode
Specifications
Case Type
SOT-23
Continuous Forward Current
250 mA
Continuous Reverse Voltage
75 V
ECCN Code
EAR99
Forward Voltage (VF)
0.95 V
Forward Voltage (VF)
1.1 V
Forward Voltage (VF)
0.85 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
2 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
1 A
Peak Forward Surge Current
4 A
Peak Repetitive Forward Current
250 mA
Peak Repetitive Reverse Voltage
100 V
Power Dissipation
350 mW
Reverse Breakdown Voltage (BVR)
100 V
Reverse Recovery Time (trr)
3000 ns
Reverse Voltage Leakage Current (IR)
0.0005 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 100V Surface mount Diode-Ultra Low Leakage Dual: Common Cathode | Box | 3,500 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMPD6001-A-C-S_R1.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Switching, Schottky and | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:I-Spice Model CMPD6001C | Spice Model |
| Spice Model:P-Spice Model CMPD6001C | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |