CMPD6263C
70V Surface mount Diode-Schottky (<1A) Dual: High Voltage: Common Cathode
Specifications
Case Type
SOT-23
Continuous Forward Current
15 mA
ECCN Code
EAR99
Forward Voltage (VF)
0.41 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
2 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
50 mA
Peak Repetitive Reverse Voltage
70 V
Power Dissipation
350 mW
Reverse Breakdown Voltage (BVR)
70 V
Reverse Voltage Leakage Current (IR)
0.2 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 70V Surface mount Diode-Schottky (<1A) Dual: High Voltage: Common Cathode | Box | 3,500 | PBFREE | |
| Active | 70V Surface mount Diode-Schottky (<1A) Dual: High Voltage: Common Cathode | Tape & Reel | 3,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMPD6263-A-C-S.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Switching, Schottky and | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CPD51V Replaces CPD102X | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Spice Model:I-Spice Model CMPD6263C | Spice Model |
| Spice Model:P-Spice Model CMPD6263C | Spice Model |
| Step File 3D Object:SOT-23 | Step File 3D Object |