CMPS5061
250mA,100V Surface mount SCR
Specifications
Average On-State Current
160 mA
Case Type
SOT-23
ECCN Code
EAR99
Forward Voltage (VTM)
1.7 V
Gate Non-Trigger Voltage (VGD)
0.1 V
Gate Trigger Current (IGT)
0.2 mA
Gate Trigger Voltage (VGT)
0.8 V
Holding Current (IH)
5 mA
HTS Code
8541.30.0080
Junction Temperature (Tj)
-65 — 125 °C
Peak Off-State Blocking Current (IDRM)
50 µA
Peak Off-State Blocking Current (IDRM)
1 µA
Peak Repetitive Off-State Voltage
100 V
Peak Repetitive Reverse Voltage
100 V
Peak Reverse Blocking Current (IRRM)
50 µA
Peak Reverse Blocking Current (IRRM)
1 µA
Power Dissipation
350 mW
RMS On-State Current
250 mA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
286 °C/W
Turn On Time (ton)
2800 ns
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Discontinued | 250mA,100V Surface mount SCR | Box | 3,500 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMPS5061-64.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product EOL Notice:CMPS5061, CMPS5062, and | Product EOL Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-23 | Step File 3D Object |