CMPZ5237B
8.2V,350mW Surface mount Diode-Zener Single: Standard
Specifications
Case Type
SOT-23
ECCN Code
EAR99
Forward Voltage (VF)
0.9 V
HTS Code
8541.10.0050
Junction Temperature (Tj)
-65 — 150 °C
Maximum Temperature Coefficient (ΘVZ)
0.062 %/°C
Power Dissipation
350 mW
Reverse Voltage Leakage Current (IR)
3 µA
Storage Temperature (Tstg)
-65 — 150 °C
Zener Impedance (ZZT)
8 Ω
Zener Knee Impedance (ZZK)
500 Ω
Zener Voltage (VZ)
7.79 — 8.61 V(8.2 V Typical)
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 8.2V,350mW Surface mount Diode-Zener Single: Standard | Box | 3,500 | PBFREE | ||
| Active | 8.2V,350mW Surface mount Diode-Zener Single: Standard | Tape & Reel | 3,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMPZ5221B-61B.PDF | Device Datasheet |
| Material Composition:SOT-23 | Material Composition |
| Package Detail Document:SOT-23 | Package Detail Document |
| Process Change Notice:All Switching, Schottky and | Process Change Notice |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X | Process Change Notice |
| Product Reliability Data:SOT-23 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-23 | Step File 3D Object |