CMSD7000
200mA,100V Surface mount Diode-Switching Dual: In Series
Specifications
Average Forward Current
200 mA
Case Type
SOT-323
ECCN Code
EAR99
Forward Voltage (VF)
0.67 — 0.82 V
Forward Voltage (VF)
0.75 — 1.1 V
Forward Voltage (VF)
0.55 — 0.7 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
2.6 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Repetitive Forward Current
500 mA
Peak Repetitive Reverse Voltage
100 V
Power Dissipation
275 mW
Reverse Breakdown Voltage (BVR)
100 V
Reverse Recovery Time (trr)
4 ns
Reverse Voltage Leakage Current (IR)
100 µA
Reverse Voltage Leakage Current (IR)
0.5 µA
Reverse Voltage Leakage Current (IR)
0.3 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
455 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 200mA,100V Surface mount Diode-Switching Dual: In Series | Box | 5,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMSD7000.PDF | Device Datasheet |
| Material Composition:SOT-323 | Material Composition |
| Package Detail Document:SOT-323 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Product Reliability Data:SOT-323 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMSD7000 | Spice Model |
| Step File 3D Object:SOT-323 (SC-70) | Step File 3D Object |