CMSZ5236B
7.5V,275mW Surface mount Diode-Zener Single: Standard
Specifications
Case Type
SOT-323
ECCN Code
EAR99
Forward Voltage (VF)
0.9 V
HTS Code
8541.10.0050
Junction Temperature (Tj)
-65 — 150 °C
Maximum Temperature Coefficient (ΘVZ)
0.058 %/°C
Power Dissipation
275 mW
Reverse Voltage Leakage Current (IR)
3 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
455 °C/W
Zener Impedance (ZZT)
6 Ω
Zener Knee Impedance (ZZK)
500 Ω
Zener Voltage (VZ)
7.125 — 7.875 V(7.5 V Typical)
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 7.5V,275mW Surface mount Diode-Zener Single: Standard | Box | 5,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMSZ5221B-61B.PDF | Device Datasheet |
| Material Composition:SOT-323 | Material Composition |
| Package Detail Document:SOT-323 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CPZ19 REPLACED WITH CPZ28 | Process Change Notice |
| Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X | Process Change Notice |
| Product Reliability Data:SOT-323 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-323 (SC-70) | Step File 3D Object |