CMSZDA5V1
5.1V,275mW Surface mount Diode-Zener Dual: Common Anode
Specifications
Case Type
SOT-323
ECCN Code
EAR99
Forward Voltage (VF)
0.9 V
HTS Code
8541.10.0050
Junction Temperature (Tj)
-65 — 150 °C
Maximum Temperature Coefficient (ΘVZ)
0.02 %/°C
Maximum Zener Current
35 mA
Power Dissipation
275 mW
Reverse Voltage Leakage Current (IR)
2 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
455 °C/W
Zener Impedance (ZZT)
60 Ω
Zener Knee Impedance (ZZK)
480 Ω
Zener Voltage (VZ)
4.8 — 5.4 V(5.1 V Typical)
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 5.1V,275mW Surface mount Diode-Zener Dual: Common Anode | Box | 5,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Copper Bond Wire | Analytical Test Report |
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMSZDA3V6-33V.PDF | Device Datasheet |
| Material Composition:SOT-323 | Material Composition |
| Package Detail Document:SOT-323 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding | Process Change Notice |
| Process Change Notice:CPZ18 REPLACED WITH CPZ28X | Process Change Notice |
| Process Change Notice:CPZ28x ----> CPZ58X/CPZ59X | Process Change Notice |
| Product Reliability Data:SOT-323 Package Reliability | Product Reliability Data |
| Step File 3D Object:SOT-323 (SC-70) | Step File 3D Object |