CMUD2838
200mA,75V Surface mount Diode-Switching Dual: Common Cathode
Specifications
Average Forward Current
200 mA
Case Type
SOT-523
ECCN Code
EAR99
Forward Voltage (VF)
1 V
Forward Voltage (VF)
1.2 V
Forward Voltage (VF)
1 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
4 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Repetitive Forward Current
300 mA
Peak Repetitive Reverse Voltage
75 V
Power Dissipation
250 mW
Reverse Breakdown Voltage (BVR)
75 V
Reverse Recovery Time (trr)
4 ns
Reverse Voltage Leakage Current (IR)
0.1 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
500 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 200mA,75V Surface mount Diode-Switching Dual: Common Cathode | Box | 5,000 | PBFREE | ||
| Active | 200mA,75V Surface mount Diode-Switching Dual: Common Cathode | Tape & Reel | 3,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMUD2836.PDF | Device Datasheet |
| Material Composition:SOT-523 | Material Composition |
| Package Detail Document:SOT-523 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-523 | Process Change Notice |
| Product Reliability Data:SOT-523 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMUD2838 | Spice Model |
| Step File 3D Object:SOT-523 (SC-89) | Step File 3D Object |