CMXD3004SR
200mA,375V Surface mount Diode-Switching Dual Pair: High Voltage: In Series
Specifications
Average Forward Current
200 mA
Case Type
SOT-26
Continuous Forward Current
225 mA
Continuous Reverse Voltage
350 V
ECCN Code
EAR99
Forward Voltage (VF)
1 V
HTS Code
8541.10.0070
Junction Capacitance (CJ)
5 pF
Junction Temperature (Tj)
-65 — 150 °C
Peak Forward Surge Current
1 A
Peak Forward Surge Current
4 A
Peak Repetitive Forward Current
625 mA
Peak Repetitive Reverse Voltage
375 V
Power Dissipation
350 mW
Reverse Breakdown Voltage (BVR)
375 V
Reverse Recovery Time (trr)
50 ns
Reverse Voltage Leakage Current (IR)
1 µA
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
357 °C/W
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination | variant_ncnr |
|---|---|---|---|---|---|---|
| Active | 200mA,375V Surface mount Diode-Switching Dual Pair: High Voltage: In Series | Box | 3,500 | PBFREE | ||
| Active | 200mA,375V Surface mount Diode-Switching Dual Pair: High Voltage: In Series | Tape & Reel | 3,000 | TIN | No |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Gold Bond Wire | Analytical Test Report |
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Henkel 84-1LMISR4 | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CMXD3004SR.PDF | Device Datasheet |
| Material Composition:SOT-26 | Material Composition |
| Package Detail Document:SOT-26 | Package Detail Document |
| Process Change Notice:SOT-26 CASE | Process Change Notice |
| Product Reliability Data:SOT-26 Package Reliability | Product Reliability Data |
| Spice Model:Spice Model CMXD3004SR | Spice Model |
| Step File 3D Object:SOT-26 | Step File 3D Object |