CS39-4D
4A,400V Through-Hole SCR
Specifications
Average Gate Power
200 mW
Case Type
TO-39
ECCN Code
EAR99
Forward Voltage (VTM)
1.95 V
Gate Non-Trigger Voltage (VGD)
0.2 V
Gate Trigger Current (IGT)
0.2 mA
Gate Trigger Voltage (VGT)
0.8 V
Holding Current (IH)
5 mA
HTS Code
8541.30.0080
Junction Temperature (Tj)
-40 — 125 °C
Peak Forward Gate Current
1.2 A
Peak Gate Power
3 W
Peak Off-State Blocking Current (IDRM)
200 µA
Peak Off-State Blocking Current (IDRM)
5 µA
Peak One Cycle Surge Current
35 A
Peak Repetitive Off-State Voltage
400 V
Peak Repetitive Reverse Voltage
400 V
Peak Reverse Blocking Current (IRRM)
200 µA
Peak Reverse Blocking Current (IRRM)
5 µA
Rate of Rise of Reverse Voltage (dv/dt)
10 V/µs
RMS On-State Current
4 A
Storage Temperature (Tstg)
-65 — 150 °C
Thermal Resistance Junction-Ambient
180 °C/W
Thermal Resistance Junction-Case
10 °C/W
Value For Fusing
4.5
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Active | 4A,400V Through-Hole SCR | Box | 500 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Bond Wire | Analytical Test Report |
| Analytical Test Report:Cap | Analytical Test Report |
| Analytical Test Report:Header | Analytical Test Report |
| Analytical Test Report:Header Assembly | Analytical Test Report |
| Analytical Test Report:Pure Tin Solder | Analytical Test Report |
| CS39-4B.PDF | Device Datasheet |
| Material Composition:TO-39 | Material Composition |
| Package Detail Document:TO-39 | Package Detail Document |
| Process Change Notice:CS39-4M | Process Change Notice |
| Product Reliability Data:TO-39 Package Reliability | Product Reliability Data |