CS89M
800mA,600V Surface mount SCR
Specifications
Average Gate Power
100 mW
Case Type
SOT-89
ECCN Code
EAR99
Forward Voltage (VTM)
1.7 V
Gate Trigger Current (IGT)
0.2 mA
Gate Trigger Voltage (VGT)
0.8 V
Holding Current (IH)
5 mA
HTS Code
8541.30.0080
Junction Temperature (Tj)
-40 — 125 °C
Peak Forward Gate Current
1 A
Peak Gate Power
2 W
Peak Gate Voltage
8 V
Peak Off-State Blocking Current (IDRM)
100 µA
Peak Off-State Blocking Current (IDRM)
1 µA
Peak One Cycle Surge Current
10 A
Peak Repetitive Off-State Voltage
600 V
Peak Repetitive Reverse Voltage
600 V
Peak Reverse Blocking Current (IRRM)
100 µA
Peak Reverse Blocking Current (IRRM)
1 µA
Rate of Rise of Reverse Voltage (dv/dt)
25 V/µs
RMS On-State Current
800 mA
Storage Temperature (Tstg)
-40 — 150 °C
Thermal Resistance Junction-Ambient
104 °C/W
Value For Fusing
0.24
Product Options
| Part | Status | Description | Packaging Code | Packaging Qty | Termination |
|---|---|---|---|---|---|
| Discontinued | 800mA,600V Surface mount SCR | Box | 900 | PBFREE | |
| Discontinued | 800mA,600V Surface mount SCR | Tape & Reel | 1,000 | PBFREE |
Resources
| Item | Type |
|---|---|
| Analytical Test Report:Green Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Halogen Epoxy Molding Compound | Analytical Test Report |
| Analytical Test Report:Leadframe | Analytical Test Report |
| Analytical Test Report:Sn Plating | Analytical Test Report |
| CS89M.PDF | Device Datasheet |
| Material Composition:SOT-89 | Material Composition |
| Package Detail Document:SOT-89 | Package Detail Document |
| Process Change Notice:Copper Wire Bonding - SOT-89 | Process Change Notice |
| Product EOL Notice:All Devices in the SOT-89 | Product EOL Notice |
| Product Reliability Data:SOT-89 Package Reliability | Product Reliability Data |