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AEM

When working with high-performance electronics, standard packaging can be the very thing holding back the practicality or feasibility of your design. Die Solutions from Central Semiconductor serve as a beacon of stability in the hybrid market, ensuring that designers have a consistent source for the discrete components they need.

By utilizing the semiconductor chip in its die form, designers are given unrivaled control over device configuration, thermal management, and electrical integrity.

  • Diodes and Rectifiers

Our product range

Processes and facilities

  • 100% of die is probed; rejects inked.
  • All die are inspected in accordance to MIL-STD-750 Method 2073.
  • Probing is performed in Central Semi's Class 1000 clean room.
  • The majority of Central Semi's die inventory is held in the US at our facility based in Hauppauge, New York.

Packing options

  • Fully probed wafers (rejects inked)
  • Waffle tray packs (100% accepted die)
  • Full wafer sawn on plastic ring (rejects inked)

Advantages of our bare die solutions

  • Sourcing: We're a US-based supplier with 50+ years serving customers sensitive to COO and maintaining the highest quality standards.
    • We maintain strategic oversight of our silicon pipeline, with 85% of wafers originating from “friendly” foundry partners in Japan and Taiwan.
    • 100% of our extensive die bank inventory is secured at our New York facility.
  • Traceability: We provide 100% traceability down to the individual wafer level. To support your manufacturing goals, we offer tailored Vendor Managed Inventory (VMI) and consignment options.
  • In-house up-screening: All specialized testing and up-screening is performed on-site at our New York facility, keeping the entire process under one roof to reduce lead time.
  • Advanced QA/FA analysis: Our commitment to zero defects is backed by 100% of wafer-level QA and FA performed by experts at our New York facility.
  • Expansive portfolio: We offer one of the industry's broadest selections of discrete devices in wafer and die form.
  • Versatility: To integrate seamlessly into your assembly process, our die solutions are available in multiple packaging options, including waffle pack (chip tray), wafer on membrane, or tape and reel.

Up-screened die solutions

We bridge the gap between commercial availability and mission-critical reliability to ensure every die meets the stringent demands of space and defense.

Learn about our up-screened die