Die Solutions
AEM/Central Semiconductor provides its device technologies in full wafer, chip tray, tape and reel, and sawn wafer on plastic ring or metal frame for best preferred assembly method. Custom wafer designs are available upon request.
AEM/Central Semiconductor provides its device technologies in full wafer, chip tray, tape and reel, and sawn wafer on plastic ring or metal frame for best preferred assembly method. Custom wafer designs are available upon request.
