Die Solutions
AEM/Central Semiconductor provides its device technologies in full wafer, chip tray, tape and reel, and sawn wafer on plastic ring or metal frame for best preferred assembly method. Custom wafer designs are available upon request.
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Category
HTS Code
Noise Density
Average Gate Power(W)
W
–W
Collector-Base Time Constant(s)
Continuous Base Current(A)
A
–A
Continuous Forward Current(A)
A
–A
Continuous Gate Current(A)
A
–A
Dynamic Impedance(Ω)
Forward Recovery Time(s)
Gate-Source Breakdown Voltage(V)
Knee Impedance(Ω)
Peak Base Current(A)
A
–A
Peak Forward Gate Current(A)
A
–A
Peak Gate Power(W)
W
–W
Peak Non-Repetitive Reverse Voltage(V)
V
–V
Peak Repetitive Off-State Voltage(V)
V
–V
Peak Repetitive Reverse Voltage(V)
V
–V
Power Output(W)
Regulator Current(A)
RMS On-State Current(A)
A
–A
RMS Reverse Voltage(V)
V
–V
Storage Temperature(°C)
Temperature Coefficient(%/°C)
Thermal Resistance Junction-Lead(°C/W)
°C/W
–°C/W
Turn-off Delay Time(s)
Zener Impedance(Ω)
Zener Knee Impedance(Ω)
Zener Voltage(V)
Showing 26–50 of 556 products